近年(nian)來，從產(chan)(chan)量構(gou)成(cheng)來看，中(zhong)國PCB產(chan)(chan)業(ye)的(de)主要產(chan)(chan)品已經(jing)由(you)單面板(ban)(ban)、雙面板(ban)(ban)轉向(xiang)多層(ceng)板(ban)(ban)，而且正在從4～6層(ceng)向(xiang)6～8層(ceng)以上提(ti)升。隨著多層(ceng)板(ban)(ban)、HDI板(ban)(ban)、柔性板(ban)(ban)的(de)快(kuai)速增長，我(wo)國的(de)PCB產(chan)(chan)業(ye)結構(gou)正在逐步得到優(you)化和改善。

　　印制(zhi)電(dian)(dian)路板(ban)(ban)(印制(zhi)線路板(ban)(ban))是(shi)(shi)當(dang)代電(dian)(dian)子(zi)元件業(ye)中最活躍的產業(ye)，其行(xing)(xing)業(ye)增(zeng)長(chang)(chang)速度(du)一般都(dou)高于電(dian)(dian)子(zi)元件產業(ye)3個百(bai)分點(dian)左右。根據各因素(su)分析，預計2006年(nian)仍將(jiang)保持較快增(zeng)長(chang)(chang)，需求升級與產業(ye)轉移是(shi)(shi)推動(dong)行(xing)(xing)業(ye)發展的基本動(dong)力，而HDI板(ban)(ban)、柔性板(ban)(ban)、IC封裝板(ban)(ban)(BGA、CSP)等品種將(jiang)成(cheng)為主要增(zeng)長(chang)(chang)點(dian)